402
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DAC
2012
ACM
13 years 9 months ago
2012
ACM
A scalable architecture to design high radix switch fabric is presented. It uses circuit techniques to re-use existing input and output data buses and switching logic for fabric c...
400
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DAC
2012
ACM
13 years 9 months ago
2012
ACM
In this paper we introduce Chisel, a new hardware construction language that supports advanced hardware design using highly parameterized generators and layered domain-specific h...
421
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DAC
2012
ACM
13 years 9 months ago
2012
ACM
Due to the breakdown of Dennardian scaling, the percentage of a silicon chip that can switch at full frequency is dropping exponentially with each process generation. This utiliza...
400
click to vote
DAC
2012
ACM
13 years 9 months ago
2012
ACM
Diverse IP cores are integrated on a modern system-on-chip and share resources. Off-chip memory bandwidth is often the scarcest resource and requires careful allocation. Two of t...
216
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DAC
2012
ACM
13 years 9 months ago
2012
ACM
Caches play an important role in embedded systems by bridging the performance gap between high speed processors and slow memory. At the same time, caches introduce imprecision in ...
194
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DAC
2012
ACM
13 years 9 months ago
2012
ACM
Large-scale process variations can significantly limit the practical utility of microelectro-mechanical systems (MEMS) for RF (radio frequency) applications. In this paper we desc...
196
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DAC
2012
ACM
13 years 9 months ago
2012
ACM
Many state-of-the-art approaches on fault-tolerant system design make the simplifying assumption that all faults are detected within a certain time interval. However, based on a d...
217
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DAC
2012
ACM
13 years 9 months ago
2012
ACM
In this paper, we present a case study of our chip prototype of a 16-node 4x4 mesh NoC fabricated in 45nm SOI CMOS that aims to simultaneously optimize energy-latency-throughput f...
171
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DAC
2012
ACM
13 years 9 months ago
2012
ACM
Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...