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ICCAD
2009
IEEE
154views Hardware» more  ICCAD 2009»
15 years 4 months ago
Pad assignment for die-stacking System-in-Package design
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
ICCS
2009
Springer
15 years 4 months ago
Dynamic Software Updates for Accelerating Scientific Discovery
Distributed parallel applications often run for hours or even days before arriving to a result. In the case of such long-running programs, the initial requirements could change aft...
Dong Kwan Kim, Myoungkyu Song, Eli Tilevich, Calvi...
ICCV
2009
IEEE
15 years 4 months ago
Real-time visual tracking via Incremental Covariance Tensor Learning
Visual tracking is a challenging problem, as an object may change its appearance due to pose variations, illumination changes, and occlusions. Many algorithms have been proposed t...
Yi Wu, Jian Cheng, Jinqiao Wang, Hanqing Lu
ICCV
2009
IEEE
15 years 4 months ago
Incremental Multiple Kernel Learning for object recognition
A good training dataset, representative of the test images expected in a given application, is critical for ensuring good performance of a visual categorization system. Obtaining ...
Aniruddha Kembhavi, Behjat Siddiquie, Roland Miezi...
ICCV
2009
IEEE
15 years 4 months ago
Complex volume and pose tracking with probabilistic dynamical models and visual hull constraints
We propose a method for estimating the pose of a human body using its approximate 3D volume (visual hull) obtained in real time from synchronized videos. Our method can cope with ...
Norimichi Ukita, Michiro Hirai, Masatsugu Kidode