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VTS
2008
IEEE
119views Hardware» more  VTS 2008»
16 years 1 months ago
Error Sequence Analysis
With increasing IC process variation and increased operating speed, it is more likely that even subtle defects will lead to the malfunctioning of a circuit. Various fault models, ...
Jaekwang Lee, Intaik Park, Edward J. McCluskey
VTS
2008
IEEE
77views Hardware» more  VTS 2008»
16 years 1 months ago
Test-Pattern Ordering for Wafer-Level Test-During-Burn-In
—Wafer-level test during burn-in (WLTBI) is a promising technique to reduce test and burn-in costs in semiconductor manufacturing. However, scan-based testing leads to significa...
Sudarshan Bahukudumbi, Krishnendu Chakrabarty
VTS
2008
IEEE
136views Hardware» more  VTS 2008»
16 years 1 months ago
Test-Pattern Grading and Pattern Selection for Small-Delay Defects
Timing-related defects are becoming increasingly important in nanometer technology designs. Small delay variations induced by crosstalk, process variations, powersupply noise, as ...
Mahmut Yilmaz, Krishnendu Chakrabarty, Mohammad Te...
WCNC
2008
IEEE
16 years 1 months ago
A Stochastic Model for Misbehaving Relays in Cooperative Diversity
—Existing cooperative diversity protocols are designed with the inherent assumption that users exhibit cooperative behavior all the time. However, in a practical cooperative wire...
Sintayehu Dehnie, Nasir D. Memon
WCNC
2008
IEEE
16 years 1 months ago
Performance Modeling of Power Saving Classes with Multiple Connections for Broadband Wireless Networks
—Different types of power-saving techniques have been proposed in various fields to alleviate the limitation on the battery lifetime for the mobile stations (MSs). In order to p...
Yu-Pin Hsu, Kai-Ten Feng
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