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ICCAD
2006
IEEE
139views Hardware» more  ICCAD 2006»
16 years 3 months ago
Analog placement with symmetry and other placement constraints
In order to handle device matching in analog circuits, some pairs of modules are required to be placed symmetrically. This paper addresses this device-level placement problem for ...
Yiu-Cheong Tam, Evangeline F. Y. Young, Chris C. N...
ICCAD
2006
IEEE
122views Hardware» more  ICCAD 2006»
16 years 3 months ago
Fill for shallow trench isolation CMP
Shallow trench isolation (STI) is the mainstream CMOS isolation technology. It uses chemical mechanical planarization (CMP) to remove excess of deposited oxide and attain a planar...
Andrew B. Kahng, Puneet Sharma, Alexander Zelikovs...
ICCAD
2006
IEEE
149views Hardware» more  ICCAD 2006»
16 years 3 months ago
Thermal sensor allocation and placement for reconfigurable systems
Temperature monitoring using thermal sensors is an essential tool for evaluating the thermal behavior and sustaining the reliable operation in high-performance and high-power syst...
Rajarshi Mukherjee, Somsubhra Mondal, Seda Ogrenci...
ICCAD
2006
IEEE
123views Hardware» more  ICCAD 2006»
16 years 3 months ago
A network-flow approach to timing-driven incremental placement for ASICs
We present a novel incremental placement methodology called FlowPlace for significantly reducing critical path delays of placed standard-cell circuits. FlowPlace includes: a) a t...
Shantanu Dutt, Huan Ren, Fenghua Yuan, Vishal Suth...
ICCAD
2006
IEEE
123views Hardware» more  ICCAD 2006»
16 years 3 months ago
A revisit to floorplan optimization by Lagrangian relaxation
With the advent of deep sub-micron (DSM) era, floorplanning has become increasingly important in physical design process. In this paper we clarify a misunderstanding in using Lag...
Chuan Lin, Hai Zhou, Chris C. N. Chu
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