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DAC
2006
ACM
16 years 7 months ago
Novel full-chip gridless routing considering double-via insertion
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures. To improve via yield and reliability, redundant-via insertion is a highl...
Huang-Yu Chen, Mei-Fang Chiang, Yao-Wen Chang, Lum...
DAC
2006
ACM
16 years 7 months ago
Optimality study of resource binding with multi-Vdds
Deploying multiple supply voltages (multi-Vdds) on one chip is an important technique to reduce dynamic power consumption. In this work we present an optimality study for resource...
Deming Chen, Jason Cong, Yiping Fan, Junjuan Xu
DAC
2006
ACM
16 years 7 months ago
High-level power management of embedded systems with application-specific energy cost functions
Most existing dynamic voltage scaling (DVS) schemes for multiple tasks assume an energy cost function (energy consumption versus execution time) that is independent of the task ch...
Youngjin Cho, Naehyuck Chang, Chaitali Chakrabarti...
DAC
2006
ACM
16 years 7 months ago
Stochastic variational analysis of large power grids considering intra-die correlations
For statistical timing and power analysis that are very important problems in the sub-100nm technologies, stochastic analysis of power grids that characterizes the voltage fluctua...
Praveen Ghanta, Sarma B. K. Vrudhula, Sarvesh Bhar...
DAC
2006
ACM
16 years 7 months ago
A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...
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