Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...
Networks-on-Chip (NoC) architectures provide a scalable solution to on-chip communication problem but the bandwidth offered by NoCs can be utilized efficiently only in presence of...
Individual white matter fibers cannot be resolved by current magnetic resonance (MR) technology. Many fibers of a fiber bundle will pass through an individual volume element (voxel...
Marc Niethammer, Sylvain Bouix, Carl-Fredrik Westi...
Models are increasingly recognized as an effective means for elaborating requirements and exploring designs. For complex systems, model building is far from an easy task. Efforts ...
Christophe Damas, Bernard Lambeau, Axel van Lamswe...
Recent software systems usually feature an automated failure reporting system, with which a huge number of failing traces are collected every day. In order to prioritize fault dia...