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3DIC
2009
IEEE
279views Hardware» more  3DIC 2009»
16 years 1 months ago
Compact modelling of Through-Silicon Vias (TSVs) in three-dimensional (3-D) integrated circuits
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
Roshan Weerasekera, Matt Grange, Dinesh Pamunuwa, ...
AINA
2009
IEEE
16 years 1 months ago
Modeling Multiprocessor Cache Protocol Impact on MPI Performance
This paper presents a modeling method particularly suited to analyze interactions between Message Passing Interface MPI library execution and distributed cache coherence protocol....
Ghassan Chehaibar, Meriem Zidouni, Radu Mateescu
DASFAA
2009
IEEE
123views Database» more  DASFAA 2009»
16 years 1 months ago
A Reprocessing Model Based on Continuous Queries for Writing Data to RFID Tag Memory
This paper investigates the problem of writing data to passive RFID tag memory and proposes a reprocessing model for assuring the atomicity and durability of writing transactions i...
Wooseok Ryu, Bonghee Hong
HICSS
2009
IEEE
116views Biometrics» more  HICSS 2009»
16 years 1 months ago
Systems Modeling for IP-Based Handoff Using Timed Petri Nets
The mechanisms and design principles needed for achieving optimized handoff for mobile Internet services are poorly understood and need better analysis. This paper contributes to ...
Ashutosh Dutta, Bryan Lyles, Henning Schulzrinne, ...
HICSS
2009
IEEE
662views Biometrics» more  HICSS 2009»
16 years 1 months ago
Modeling Collaborative Behavior: Foundations for Collaboration Technologies
Can models of collaboration serve as a foundation for development of collaborative technologies in much the same way that engineers use models when developing complex systems? We ...
Steven E. Poltrock, Mark Handel