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DAC
2010
ACM
15 years 10 months ago
Cost-driven 3D integration with interconnect layers
The ever increasing die area of Chip Multiprocessors (CMPs) affects manufacturing yield, resulting in higher manufacture cost. Meanwhile, network-on-chip (NoC) has emerged as a p...
Xiaoxia Wu, Guangyu Sun, Xiangyu Dong, Reetuparna ...
DAC
2010
ACM
15 years 10 months ago
PreDVS: preemptive dynamic voltage scaling for real-time systems using approximation scheme
System optimization techniques based on dynamic voltage scaling (DVS) are widely used with the aim of reducing processor energy consumption. Inter-task DVS assigns the same voltag...
Weixun Wang, Prabhat Mishra
DAC
2010
ACM
15 years 10 months ago
A parallel integer programming approach to global routing
We propose a parallel global routing algorithm that concurrently processes routing subproblems corresponding to rectangular subregions covering the chip area. The algorithm uses a...
Tai-Hsuan Wu, Azadeh Davoodi, Jeffrey T. Linderoth
FC
2010
Springer
171views Cryptology» more  FC 2010»
15 years 10 months ago
The Phish-Market Protocol: Securely Sharing Attack Data between Competitors
A key way in which banks mitigate the effects of phishing is to remove fraudulent websites or suspend abusive domain names. This ‘take-down’ is often subcontracted to special...
Tal Moran, Tyler Moore
ICDCS
2010
IEEE
15 years 10 months ago
New Algorithms for Planning Bulk Transfer via Internet and Shipping Networks
—Cloud computing is enabling groups of academic collaborators, groups of business partners, etc., to come together in an ad-hoc manner. This paper focuses on the group-based data...
Brian Cho, Indranil Gupta