2372 search results - page 169 / 475 » is 2012 |
216
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ARC
2012
Springer
14 years 2 months ago
2012
Springer
As the size of FPGA devices grows following Moore’s law, it becomes possible to put a complete manycore system onto a single FPGA chip. The centralized memory hierarchy on typica...
212
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ARCS
2012
Springer
14 years 2 months ago
2012
Springer
Abstract: In this paper, we present an acceleration method for texture-based ray casting on the compute unified device architecture (CUDA) compatible graphics processing unit (GPU...
146
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ASPDAC
2012
ACM
14 years 2 months ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
178
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ASPDAC
2012
ACM
14 years 2 months ago
2012
ACM
In this paper, we examine the integration potential and explore the design space of low power thermal reliable on-chip interconnect synthesis featuring nanophotonics Wavelength Di...
159
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ASPDAC
2012
ACM
14 years 2 months ago
2012
ACM
— In this paper, we present an obstacle-aware clock tree synthesis method for through-silicon-via (TSV)-based 3D ICs. A unique aspect of this problem lies in the fact that variou...