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265
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DATE
2006
IEEE
16 years 1 months ago
2006
IEEE
same level of system-level CAD support that is now commonplace in the IC industry.Recent advances in microfluidics are expected to lead to sensor systems for high-throughput bioche...
200
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DATE
2006
IEEE
16 years 1 months ago
2006
IEEE
—The clock distribution network is a key component of any synchronous VLSI design. High power dissipation and pressure volume temperature-induced variations in clock skew have st...
197
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DATE
2006
IEEE
16 years 1 months ago
2006
IEEE
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
234
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DEXAW
2006
IEEE
16 years 1 months ago
2006
IEEE
: Scalable Distributed Data Structures (SDDSs) store large scalable files over a distributed RAM of nodes in a grid or a P2P network. The files scale transparently for the applicat...
190
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DFT
2006
IEEE
16 years 1 months ago
2006
IEEE
1 High temperature has become a major problem for system-on-chip testing. In order to reduce the test time while keeping the temperature of the chip under test within a safe range,...