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ICCAD
2006
IEEE
122views Hardware» more  ICCAD 2006»
16 years 4 months ago
Fill for shallow trench isolation CMP
Shallow trench isolation (STI) is the mainstream CMOS isolation technology. It uses chemical mechanical planarization (CMP) to remove excess of deposited oxide and attain a planar...
Andrew B. Kahng, Puneet Sharma, Alexander Zelikovs...
ICCAD
2006
IEEE
190views Hardware» more  ICCAD 2006»
16 years 4 months ago
Factor cuts
Enumeration of bounded size cuts is an important step in several logic synthesis algorithms such as technology mapping and re-writing. The standard algorithm does not scale beyond...
Satrajit Chatterjee, Alan Mishchenko, Robert K. Br...
ICCAD
2006
IEEE
108views Hardware» more  ICCAD 2006»
16 years 4 months ago
Soft error reduction in combinational logic using gate resizing and flipflop selection
Soft errors in logic are emerging as a significant reliability problem for VLSI designs. This paper presents novel circuit optimization techniques to mitigate soft error rates (SE...
Rajeev R. Rao, David Blaauw, Dennis Sylvester
ICCAD
2006
IEEE
119views Hardware» more  ICCAD 2006»
16 years 4 months ago
Post-placement voltage island generation
High power consumption will shorten battery life for handheld devices and cause thermal and reliability problems. One way to lower the dynamic power consumption is to reduce the s...
Royce L. S. Ching, Evangeline F. Y. Young, Kevin C...
ICCAD
2006
IEEE
149views Hardware» more  ICCAD 2006»
16 years 4 months ago
Thermal sensor allocation and placement for reconfigurable systems
Temperature monitoring using thermal sensors is an essential tool for evaluating the thermal behavior and sustaining the reliable operation in high-performance and high-power syst...
Rajarshi Mukherjee, Somsubhra Mondal, Seda Ogrenci...
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