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157
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ICCAD
2008
IEEE
16 years 3 months ago
2008
IEEE
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
146
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ICCAD
2008
IEEE
16 years 3 months ago
2008
IEEE
– Due to reduction in device feature size and supply voltage, the sensitivity of digital systems to transient faults is increasing dramatically. As technology scales further, the...
191
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3DIC
2009
IEEE
16 years 1 months ago
2009
IEEE
The first memristor, originally theorized by Dr. Leon Chua in 1971, was identified by a team at HP Labs in 2008. This new fundamental circuit element is unique in that its resis...
157
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FSTTCS
2009
Springer
16 years 1 months ago
2009
Springer
We describe a simple iterative method for proving a variety of results in combinatorial optimization. It is inspired by Jain’s iterative rounding method (FOCS 1998) for designing...
186
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ACHI
2008
IEEE
16 years 1 months ago
2008
IEEE
Computers have been widely deployed to our daily lives, but human-computer interaction still lacks intuition. Researchers intend to resolve these shortcomings by augmenting tradit...