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2009
IEEE
112views Hardware» more  DATE 2009»
16 years 28 days ago
Package routability- and IR-drop-aware finger/pad assignment in chip-package co-design
—Due to increasing complexity of design interactions between the chip, package and PCB, it is essential to consider them at the same time. Specifically the finger/pad locations...
Chao-Hung Lu, Hung-Ming Chen, Chien-Nan Jimmy Liu,...
DATE
2009
IEEE
110views Hardware» more  DATE 2009»
16 years 28 days ago
Light NUCA: A proposal for bridging the inter-cache latency gap
Abstract—To deal with the “memory wall” problem, microprocessors include large secondary on-chip caches. But as these caches enlarge, they originate a new latency gap between...
Darío Suárez Gracia, Teresa Monreal,...
DATE
2009
IEEE
123views Hardware» more  DATE 2009»
15 years 10 months ago
Novel library of logic gates with ambipolar CNTFETs: Opportunities for multi-level logic synthesis
This paper exploits the unique in-field controllability of the device polarity of ambipolar carbon nanotube field effect transistors (CNTFETs) to design a technology library with ...
M. Haykel Ben Jamaa, Kartik Mohanram, Giovanni De ...
DATE
2009
IEEE
115views Hardware» more  DATE 2009»
15 years 10 months ago
Customizing IP cores for system-on-chip designs using extensive external don't-cares
Traditional digital circuit synthesis flows start from an HDL behavioral definition and assume that circuit functions are almost completely defined, making don't-care conditio...
Kai-Hui Chang, Valeria Bertacco, Igor L. Markov
DATE
2009
IEEE
131views Hardware» more  DATE 2009»
15 years 9 months ago
Optimizations of an application-level protocol for enhanced dependability in FlexRay
FlexRay [9] is an automotive standard for high-speed and reliable communication that is being widely deployed for next generation cars. The protocol has powerful errordetection me...
Wenchao Li, Marco Di Natale, Wei Zheng, Paolo Gius...