— In this paper, we present the first work on the Steiner routing for 3D stacked ICs. In the 3D Steiner routing problem, the pins are located in multiple device layers, which ma...
— As technology scales, the delay uncertainty caused by process variations has become increasingly pronounced in deep submicron designs. As a result, a paradigm shift from determ...
Feng Wang 0004, Chrysostomos Nicopoulos, Xiaoxia W...
— The need to perform power analysis in the early stages of the design process has become critical as power has become a major design constraint. Embedded and highperformance mic...
ion Chao Wang NEC Laboratories America Hyondeuk Kim University of Colorado Aarti Gupta NEC Laboratories America Variable hiding and predicate abstraction are two popular abstracti...
—At present there is a strong worldwide push toward bringing fiber closer to individual homes and businesses. Another evolutionary step is the cost-effective all-optical integra...
Lehan Meng, Chadi Assi, Martin Maier, Ahmad R. Dha...