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2009
IEEE
146views Hardware» more  DATE 2009»
16 years 1 months ago
System-level power/performance evaluation of 3D stacked DRAMs for mobile applications
Abstract—Convergence of communication, consumer applications and computing within mobile systems pushes memory requirements both in terms of size, bandwidth and power consumption...
Marco Facchini, Trevor Carlson, Anselme Vignon, Ma...
DATE
2009
IEEE
155views Hardware» more  DATE 2009»
16 years 1 months ago
Using non-volatile memory to save energy in servers
Abstract—Recent breakthroughs in circuit and process technology have enabled new usage models for non-volatile memory technologies such as Flash and phase change RAM (PCRAM) in t...
David Roberts, Taeho Kgil, Trevor N. Mudge
DATE
2009
IEEE
155views Hardware» more  DATE 2009»
16 years 1 months ago
Dynamic thermal management in 3D multicore architectures
— Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architec...
Ayse Kivilcim Coskun, José L. Ayala, David ...
DATE
2009
IEEE
89views Hardware» more  DATE 2009»
16 years 1 months ago
Robust non-preemptive hard real-time scheduling for clustered multicore platforms
—Scheduling task graphs under hard (end-to-end) timing constraints is an extensively studied NP-hard problem of critical importance for predictable software mapping on Multiproce...
Michele Lombardi, Michela Milano, Luca Benini
DATE
2009
IEEE
107views Hardware» more  DATE 2009»
16 years 1 months ago
Learning early-stage platform dimensioning from late-stage timing verification
— Today's innovations in the automotive sector are, to a great extent, based on electronics. The increasing integration complexity and stringent cost reduction goals turn E/...
Kai Richter, Marek Jersak, Rolf Ernst
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