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DAC
2009
ACM
16 years 8 months ago
Thermal-driven analog placement considering device matching
With the thermal effect, improper analog placements may degrade circuit performance because the thermal impact from power devices can affect electrical characteristics of the ther...
Po-Hung Lin, Hongbo Zhang, Martin D. F. Wong, Yao-...
DAC
2009
ACM
16 years 8 months ago
Event-driven gate-level simulation with GP-GPUs
Logic simulation is a critical component of the design tool flow in modern hardware development efforts. It is used widely ? from high-level descriptions down to gate-level ones ?...
Debapriya Chatterjee, Andrew DeOrio, Valeria Berta...
DAC
2009
ACM
16 years 8 months ago
Improving testability and soft-error resilience through retiming
State elements are increasingly vulnerable to soft errors due to their decreasing size, and the fact that latched errors cannot be completely eliminated by electrical or timing ma...
Smita Krishnaswamy, Igor L. Markov, John P. Hayes
DAC
2009
ACM
16 years 8 months ago
SRAM parametric failure analysis
With aggressive technology scaling, SRAM design has been seriously challenged by the difficulties in analyzing rare failure events. In this paper we propose to create statistical ...
Jian Wang, Soner Yaldiz, Xin Li, Lawrence T. Pileg...
DAC
2009
ACM
16 years 8 months ago
Spare-cell-aware multilevel analytical placement
Post-silicon validation has recently drawn designers' attention due to its increasing impacts on the VLSI design cycle and cost. One key feature of the post-silicon validatio...
Zhe-Wei Jiang, Meng-Kai Hsu, Yao-Wen Chang, Kai-Yu...
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