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170
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CORR
2008
Springer
15 years 6 months ago
2008
Springer
We describe a new approach to fit the polyhedron describing a 3D building model to the point cloud of a Digital Elevation Model (DEM). We introduce a new kinetic framework that hi...
125
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CORR
2008
Springer
15 years 6 months ago
2008
Springer
Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
148
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CORR
2008
Springer
15 years 6 months ago
2008
Springer
We present three voting protocols with unconditional privacy and information-theoretic correctness, without assuming any bound on the number of corrupt voters or voting authorities...
189
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CORR
2008
Springer
15 years 6 months ago
2008
Springer
In a distributed space-time coding scheme, based on the relay channel model, the relay nodes co-operate to linearly process the transmitted signal from the source and forward them ...
190
click to vote
CORR
2008
Springer
15 years 6 months ago
2008
Springer
We propose a unified framework for deriving and studying soft-in soft-out (SISO) detection in multiple-access channels using the concept of variational inference. The proposed fram...