As device size shrinks to the nanometer range, FPGAs are increasingly prone to manufacturing defects. We anticipate that the ability to tolerate multiple defects will be very impo...
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
We present a case study parallelizing streaming aggregation on three different parallel hardware architectures. Aggregation is a performance-critical operation for data summarizat...
Scott Schneider, Henrique Andrade, Bugra Gedik, Ku...
Abstract. Service and process-oriented systems promise to provide more effective business and work processes and more flexible and adaptable enterprise IT systems. However, the t...
They appeared in our life only few years ago and now they are everywhere: computers have become ubiquitous and, almost, irreplaceable. Classical ways of creating, managing and exch...