8009 search results - page 1463 / 1602 » cans 2005 |
172
click to vote
ICCAD
2005
IEEE
16 years 3 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
186
click to vote
SOSP
2005
ACM
16 years 3 months ago
2005
ACM
This paper describes a general approach to constructing cooperative services that span multiple administrative domains. In such environments, protocols must tolerate both Byzantin...
171
click to vote
SOSP
2005
ACM
16 years 3 months ago
2005
ACM
We present a method for automatically extracting from a running system an indexable signature that distills the essential characteristic from a system state and that can be subjec...
152
click to vote
SOSP
2005
ACM
16 years 3 months ago
2005
ACM
Recovery from intrusions is typically a very time-consuming operation in current systems. At a time when the cost of human resources dominates the cost of computing resources, we ...
183
click to vote
SOSP
2005
ACM
16 years 3 months ago
2005
ACM
This paper presents the design and an evaluation of Mondrix, a version of the Linux kernel with Mondriaan Memory Protection (MMP). MMP is a combination of hardware and software th...