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170
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ICCAD
2008
IEEE
16 years 1 months ago
2008
IEEE
— The area-I/O flip-chip package provides a high chip-density solution to the demand of more I/O’s in VLSI designs; it can achieve smaller package size, shorter wirelength, an...
178
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ICCCN
2008
IEEE
16 years 1 months ago
2008
IEEE
—The problem of designing high capacity and high bit rate IP-over-WDM networks, which can provide uninterrupted service in the presence of network equipment failures, continues t...
319
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ICCCN
2008
IEEE
16 years 1 months ago
2008
IEEE
—The core functionality of a wireless sensor network (WSN) is to detect deviations in expected normal behavior and report it to the sink. In this paper, we propose TRACK — a no...
189
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ICCCN
2008
IEEE
16 years 1 months ago
2008
IEEE
As commodity components continue to dominate the realm of high-end computing, two hardware trends have emerged as major contributors—high-speed networking technologies and multi...
184
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ICCCN
2008
IEEE
16 years 1 months ago
2008
IEEE
—Owing to the limited requirement for sensor processing in early networked sensor nodes, embedded software was generally built around the communication stack. Modern sensor nodes...