In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
In this paper, we present an efficient method to solve the obstacle-avoiding rectilinear Steiner minimum tree (OARSMT) problem optimally. Our work is a major improvement over the w...
Dataset shift from the training data in a source domain to the data in a target domain poses a great challenge for many statistical learning methods. Most algorithms can be viewed ...
Background knowledge is an important factor in privacy preserving data publishing. Probabilistic distributionbased background knowledge is a powerful kind of background knowledge w...
Raymond Chi-Wing Wong, Ada Wai-Chee Fu, Ke Wang, Y...
In this paper, we study probabilistic modeling of heterogeneously attributed multi-dimensional arrays. The model can manage the heterogeneity by employing an individual exponential...