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DAC
2006
ACM
16 years 7 months ago
A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...
ISCA
2009
IEEE
146views Hardware» more  ISCA 2009»
16 years 1 months ago
Multi-execution: multicore caching for data-similar executions
While microprocessor designers turn to multicore architectures to sustain performance expectations, the dramatic increase in parallelism of such architectures will put substantial...
Susmit Biswas, Diana Franklin, Alan Savage, Ryan D...
MICRO
2009
IEEE
160views Hardware» more  MICRO 2009»
16 years 1 months ago
Variation-tolerant non-uniform 3D cache management in die stacked multicore processor
Process variations in integrated circuits have significant impact on their performance, leakage and stability. This is particularly evident in large, regular and dense structures...
Bo Zhao, Yu Du, Youtao Zhang, Jun Yang 0002
IWMM
2009
Springer
152views Hardware» more  IWMM 2009»
16 years 1 months ago
A new approach to parallelising tracing algorithms
Tracing algorithms visit reachable nodes in a graph and are central to activities such as garbage collection, marshalling etc. Traditional sequential algorithms use a worklist, re...
Cosmin E. Oancea, Alan Mycroft, Stephen M. Watt
EMSOFT
2007
Springer
16 years 19 days ago
Buffer optimization and dispatching scheme for embedded systems with behavioral transparency
Software components are modular and can enable post-deployment update, but their high overhead in runtime and memory is prohibitive for many embedded systems. This paper proposes ...
Jiwon Hahn, Pai H. Chou