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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
16 years 3 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
196
Voted
ICCV
2007
IEEE
16 years 1 months ago
Fast Automatic Heart Chamber Segmentation from 3D CT Data Using Marginal Space Learning and Steerable Features
Multi-chamber heart segmentation is a prerequisite for global quantification of the cardiac function. The complexity of cardiac anatomy, poor contrast, noise or motion artifacts ...
Yefeng Zheng, Adrian Barbu, Bogdan Georgescu, Mich...
IMR
2004
Springer
16 years 2 days ago
3D Hybrid Mesh Generation for Reservoir Flow Simulation
A great challenge for flow simulators of new generation is to gain more accuracy at well proximity within complex geological structures. For this purpose, a new approach based on...
N. Flandrin, Houman Borouchaki, Chakib Bennis
AES
2008
Springer
97views Cryptology» more  AES 2008»
15 years 6 months ago
Software mechanisms for extensible and scalable 3D visualization of construction operations
This paper presents research that led to the design and implementation of an extensible and scalable software framework for the dynamic 3D visualization of simulated construction ...
Vineet R. Kamat, Julio C. Martínez
3DIM
2011
IEEE
14 years 6 months ago
A Non-cooperative Game for 3D Object Recognition in Cluttered Scenes
Abstract—During the last few years a wide range of algorithms and devices have been made available to easily acquire range images. To this extent, the increasing abundance of dep...
Andrea Albarelli, Emanuele Rodolà, Filippo ...