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DATE
2009
IEEE
113views Hardware» more  DATE 2009»
16 years 1 months ago
System-level process variability analysis and mitigation for 3D MPSoCs
Abstract—While prior research has extensively evaluated the performance advantage of moving from a 2D to a 3D design style, the impact of process parameter variations on 3D desig...
Siddharth Garg, Diana Marculescu
IPMI
2005
Springer
16 years 3 days ago
Fundamental Limits in 3D Landmark Localization
This work analyses the accuracy of estimating the location of 3D landmarks and characteristic image structures. Based on nonlinear estimation theory we study the minimal stochastic...
Karl Rohr
ICCV
2007
IEEE
16 years 8 months ago
What Can Casual Walkers Tell Us About A 3D Scene?
An approach for incremental learning of a 3D scene from a single static video camera is presented in this paper. In particular, we exploit the presence of casual people walking in...
Diego Rother, Kedar A. Patwardhan, Guillermo Sapir...
207
Voted
NANONET
2009
Springer
199views Chemistry» more  NANONET 2009»
15 years 11 months ago
Through Silicon Via-Based Grid for Thermal Control in 3D Chips
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
José L. Ayala, Arvind Sridhar, Vinod Pangra...
ECCV
2008
Springer
16 years 8 months ago
Simultaneous Detection and Registration for Ileo-Cecal Valve Detection in 3D CT Colonography
Object detection and recognition has achieved a significant progress in recent years. However robust 3D object detection and segmentation in noisy 3D data volumes remains a challen...
Le Lu, Adrian Barbu, Matthias Wolf, Jianming Liang...