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ICCAD
2006
IEEE
124views Hardware» more  ICCAD 2006»
16 years 3 months ago
Simultaneous power and thermal integrity driven via stapling in 3D ICs
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...
Hao Yu, Joanna Ho, Lei He
ICRA
2009
IEEE
125views Robotics» more  ICRA 2009»
16 years 1 months ago
On computing robust n-finger force-closure grasps of 3D objects
Abstract— The paper deals with computing frictional forceclosure grasps of 3D objects problem. The key idea of the presented work is the demonstration that wrenches associated to...
Sahar El-Khoury, Anis Sahbani
ICASSP
2008
IEEE
16 years 1 months ago
3D facial expression recognition using swarm intelligence
In this paper, we present a novel approach for 3D facial expression recognition which is inspired by the advances of ant colony and particle swarm optimization (ACO and PSO respec...
Iordanis Mpiperis, Sotiris Malassiotis, Vassilios ...
ICIP
2007
IEEE
16 years 28 days ago
Spatio-Temporal Registration Techniques for Relightable 3D Video
By jointly applying a model-based marker-less motion capture approach and multi-view texture generation 3D Videos of human actors can be reconstructed from multi-view video stream...
Naveed Ahmed, Christian Theobalt, Marcus A. Magnor...
DAGM
2007
Springer
16 years 23 days ago
Extraction of 3D Unfoliaged Trees from Image Sequences Via a Generative Statistical Approach
In this paper we propose a generative statistical approach for the three dimensional (3D) extraction of the branching structure of unfoliaged deciduous trees from urban image seque...
Hai Huang, Helmut Mayer