Data represented geometrically in high-dimensional vector spaces can be found in many applications. Images and videos, are often represented by assigning a dimension for every pix...
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Abstract. The intruder deduction problem for an electronic purse protocol with blind signatures is considered. The algebraic properties of the protocol are modeled by an equational...
Statistical static timing analysis (SSTA) is emerging as a solution for predicting the timing characteristics of digital circuits under process variability. For computing the stat...
Kaviraj Chopra, Bo Zhai, David Blaauw, Dennis Sylv...
We introduce dynamic correlated topic models (DCTM) for analyzing discrete data over time. This model is inspired by the hierarchical Gaussian process latent variable models (GP-L...