6111 search results - page 710 / 1223 » Time, Hardware, and Uniformity |
173
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ISPD
2003
ACM
16 years 14 days ago
2003
ACM
Previous works on buffer planning are mainly based on fixed die placement. It is necessary to reduce the complexity of computing the feasible buffer insertion sites to integrate t...
155
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DATE
2010
IEEE
16 years 9 days ago
2010
IEEE
- Electronic systems for safety-critical automotive applications must operate for many years in harsh environments. Reliability issues are worsening with device scaling down, while...
196
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DATE
2010
IEEE
16 years 9 days ago
2010
IEEE
Abstract—rSesame is a generic modeling and simulation framework which can explore and evaluate reconfigurable systems at the early design stages. The framework can be used to ex...
189
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DATE
2002
IEEE
16 years 5 days ago
2002
IEEE
Advancing technology drives design technology and thus design automation EDA . How to model interconnect, how to handle degradation of signal integrity and increasing power densi...
182
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ISQED
2002
IEEE
16 years 3 days ago
2002
IEEE
As the process technology advances into the deep submicron era, interconnect plays a dominant role in determining circuit performance. Buffer insertion/sizing and wire sizing are ...