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163
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ICCAD
2008
IEEE
16 years 1 months ago
2008
IEEE
— The area-I/O flip-chip package provides a high chip-density solution to the demand of more I/O’s in VLSI designs; it can achieve smaller package size, shorter wirelength, an...
163
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ISCA
2008
IEEE
16 years 1 months ago
2008
IEEE
We expect that many-core microprocessors will push performance per chip from the 10 gigaflop to the 10 teraflop range in the coming decade. To support this increased performance...
164
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ISCA
2008
IEEE
16 years 1 months ago
2008
IEEE
In a chip-multiprocessor (CMP) system, the DRAM system is shared among cores. In a shared DRAM system, requests from a thread can not only delay requests from other threads by cau...
196
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ISCA
2008
IEEE
16 years 1 months ago
2008
IEEE
Flash is a widely used storage device that provides high density and low power, appealing properties for general purpose computing. Today, its usual application is in portable spe...
167
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ISCAS
2008
IEEE
16 years 1 months ago
2008
IEEE
Abstract— Inter frame prediction technique significantly improves the compression efficiency in the hybrid video coding schemes. However, this technique causes the decoding dep...