1476 search results - page 198 / 296 » Three-dimensional integrated circuits |
148
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ISCAS
1999
IEEE
15 years 10 months ago
1999
IEEE
The advent of portable and high-density devices has made power consumption a critical design concern. In this paper, we address the problem of reducing power consumption via gate-...
143
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ISCAS
1999
IEEE
15 years 10 months ago
1999
IEEE
This paper describes a high performance CMOS differential input front-end, designed for optical wireless communications. The front-end achieves a 50 MHz bandwidth and a 400 K tran...
161
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TPHOL
1999
IEEE
15 years 10 months ago
1999
IEEE
Combining theorem proving and model checking o ers the tantalizing possibility of e ciently reasoning about large circuits at high levels of abstraction. We have constructed a syst...
131
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ISPD
1998
ACM
15 years 10 months ago
1998
ACM
With the recent advent of deep sub-micron technology and new packaging schemes such as Multi-Chip Modules(MCMs), integrated circuit components are often not rectangular. Most exis...
152
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ISCA
1996
IEEE
15 years 10 months ago
1996
IEEE
In the future, advanced integrated circuit processing and packaging technology will allow for several design options for multiprocessor microprocessors. In this paper we consider ...