1476 search results - page 181 / 296 » Three-dimensional integrated circuits |
145
click to vote
DATE
2010
IEEE
15 years 11 months ago
2010
IEEE
: Scaling down in very deep submicron (VDSM) technologies increases the delay, power consumption of on-chip interconnects, while the reliability and yield decrease. In high perform...
148
click to vote
DFT
1999
IEEE
15 years 10 months ago
1999
IEEE
A programmable single-chip multiprocessor system for video coding has been developed. The system is implemented in a high-performance 0.25 m logic/embedded DRAM process. It integr...
177
click to vote
ISSS
1999
IEEE
15 years 10 months ago
1999
IEEE
In order to cope with the ever increasing complexity of todays application specific integrated circuits, a building block based design methodology is established. The system is co...
158
click to vote
DAC
1996
ACM
15 years 10 months ago
1996
ACM
This paper provides a case study that shows how a demanding application stresses the capabilities of today's CAD tools, especially in the integration of products from multipl...
149
click to vote
FTEDA
2008
15 years 6 months ago
2008
With greater integration, the power dissipation in integrated circuits has begun to outpace the ability of today's heat sinks to limit the on-chip temperature. As a result, t...