1476 search results - page 173 / 296 » Three-dimensional integrated circuits |
165
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ISPD
2009
ACM
16 years 1 months ago
2009
ACM
Glitches (spurious transitions) are common in electronic circuits. In this paper we present a novel approach to reduce dynamic power in FPGAs by reducing glitches during the routi...
145
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DATE
2009
IEEE
16 years 1 months ago
2009
IEEE
Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
185
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RECONFIG
2009
IEEE
16 years 1 months ago
2009
IEEE
Abstract—Integrated circuits for very high-speed telecommunication protocols often use ASICs, due to their strict timing constraints. This scenario is changing, since modern FPGA...
171
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HOST
2008
IEEE
16 years 22 days ago
2008
IEEE
—A number of applications depend on the protection of security-sensitive hardware, preventing unauthorized users from gaining access to the functionality of the integrated circui...
163
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ISQED
2008
IEEE
16 years 20 days ago
2008
IEEE
Negative bias temperature instability (NBTI) is one of the primary limiters of reliability lifetime in nano-scale integrated circuits. NBTI manifests itself in a gradual increase ...