1635 search results - page 95 / 327 » Thermally Aware Design |
136
click to vote
ASAP
2004
IEEE
15 years 10 months ago
2004
IEEE
As technology scales, transient faults have emerged as a key challenge for reliable embedded system design. This paper proposes a design methodology that incorporates reliability i...
209
click to vote
SLIP
2009
ACM
16 years 28 days ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
191
click to vote
ISPD
2005
ACM
15 years 12 months ago
2005
ACM
The sustained progress of VLSI technology has altered the landscape of routing which is a major physical design stage. For timing driven routings, traditional approaches which con...
147
click to vote
ISVLSI
2006
IEEE
16 years 13 days ago
2006
IEEE
— Based on the proposed reliability characterization model, reliability-bounded low-power design as a methodology to balance reliability enhancement and power reduction in chip d...
178
click to vote
JUCS
2008
15 years 6 months ago
2008
: This paper presents a proposal to tackle the design and development of user interfaces for groupware applications. This proposal includes important design and implementation issu...