1635 search results - page 80 / 327 » Thermally Aware Design |
141
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ICCAD
2004
IEEE
16 years 3 months ago
2004
IEEE
Thermal effects are becoming a limiting factor in highperformance circuit design due to the strong temperaturedependence of leakage power, circuit performance, IC package cost and...
166
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FDL
2006
IEEE
16 years 13 days ago
2006
IEEE
Needs in the worldwide competition push teams to master more and more their design flow in order to minimize risks, costs, time to market, and potential liabilities. The classical...
169
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DAC
2011
ACM
14 years 6 months ago
2011
ACM
Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with m...
169
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ICCD
2007
IEEE
16 years 3 months ago
2007
IEEE
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
144
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ASPDAC
2012
ACM
14 years 2 months ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...