1635 search results - page 219 / 327 » Thermally Aware Design |
186
click to vote
DAC
2009
ACM
16 years 7 months ago
2009
ACM
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
183
click to vote
GECCO
2004
Springer
15 years 11 months ago
2004
Springer
Portable embedded systems are being driven by consumer demands to be thermally efficient, perform faster, and have longer battery life. To design such a system, various hardware un...
155
click to vote
CHI
2007
ACM
16 years 6 months ago
2007
ACM
The paper reports on the evaluation of a rapid usability kick-off technique (RUKO). Ten mobile service development projects in the company applied the technique during the early a...
174
click to vote
TEI
2010
ACM
16 years 1 months ago
2010
ACM
We designed and prototyped WearAir, an expressive T-shirt to sense the wearer’s surrounding air quality as indicated by the measured volatile organic compounds (VOCs) and public...
157
click to vote
DATE
2009
IEEE
16 years 1 months ago
2009
IEEE
Multi-core architectures are increasingly being adopted in the design of emerging complex embedded systems. Key issues of designing such systems are on-chip interconnects, memory a...