1635 search results - page 203 / 327 » Thermally Aware Design |
153
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FPGA
2007
ACM
16 years 17 days ago
2007
ACM
Chip design in the nanometer regime is becoming increasingly difficult due to process variations. ASIC designers have adopted statistical optimization techniques to mitigate the e...
166
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WAC
2005
Springer
15 years 12 months ago
2005
Springer
We present the design and implementation of a working prototype system that enables self-configuration in mobile ad hoc networks (MANETs) by exploiting context awareness and cross-...
167
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DAC
2006
ACM
16 years 7 months ago
2006
ACM
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
172
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CHI
2007
ACM
16 years 6 months ago
2007
ACM
This paper shares our experience with a strategic design project for defining the key user experience scenarios for utilizing location information available on mobile devices. Whi...
199
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FPL
2004
Springer
15 years 10 months ago
2004
Springer
A recent trend towards integrating FPGAs with many heterogeneous components, such as memory systems, dedicated multipliers, etc., has made them an attractive option for implementin...