1635 search results - page 190 / 327 » Thermally Aware Design |
129
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ASPDAC
2005
ACM
15 years 12 months ago
2005
ACM
3-D IC has a great potential for improving circuit performance and degree of integration. It is also an attractive platform for system-on-chip or system-in-package solutions. A cr...
154
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ECCV
2006
Springer
16 years 8 months ago
2006
Springer
Abstract. Active Appearance Models (AAM) are compact representations of the shape and appearance of objects. Fitting AAMs to images is a difficult, non-linear optimization task. Tr...
185
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VLSID
2002
IEEE
16 years 6 months ago
2002
IEEE
Among the many techniques for system-level power management, it is not currently possible to guarantee timing constraints and have a comprehensive system model at the same time. S...
241
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VLDB
2008
ACM
16 years 6 months ago
2008
ACM
Large highly distributed data sets are poorly supported by current query technologies. Applications such as endsystembased network management are characterized by data stored on l...
191
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ACSC
2009
IEEE
16 years 1 months ago
2009
IEEE
Abstract— Hybrid Wireless Mesh Networks (WMN) are generally employed to establish communication during disaster recovery operations. The Hybrid WMN network is formed in a spontan...