1635 search results - page 125 / 327 » Thermally Aware Design |
158
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DATE
2006
IEEE
16 years 16 days ago
2006
IEEE
Increasing miniaturization is posing multiple challenges to electronic designers. In the context of Multi-Processor System-onChips (MPSoCs), we focus on the problem of implementin...
131
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DATE
2006
IEEE
16 years 16 days ago
2006
IEEE
Process variations due to lens aberrations are to a large extent systematic, and can be modeled for purposes of analyses and optimizations in the design phase. Traditionally, vari...
184
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ISCA
2006
IEEE
16 years 14 days ago
2006
IEEE
Improvements in semiconductor technology have made it possible to include multiple processor cores on a single die. Chip Multi-Processors (CMP) are an attractive choice for future...
168
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INFOCOM
2005
IEEE
16 years 1 days ago
2005
IEEE
— Wireless sensor networks offer the potential to span and monitor large geographical areas inexpensively. Sensor network databases like TinyDB [1] are the dominant architectures...
192
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PDP
2005
IEEE
16 years 1 days ago
2005
IEEE
Clusters of SMPs are becoming increasingly common. However, the shared memory design of SMPs and the consequential contention between system processors for access to main memory c...