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MJ
2011
288views Multimedia» more  MJ 2011»
15 years 27 days ago
Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
Pablo Garcia Del Valle, David Atienza
IPPS
2007
IEEE
16 years 7 days ago
Power, Performance, and Thermal Management for High-Performance Systems
In future high-performance systems it will be essential to balance often-conflicting objectives of performance, power, energy, and temperature under variable workload and environ...
Heather Hanson, Stephen W. Keckler, Karthick Rajam...
IPPS
1998
IEEE
15 years 10 months ago
Thermal Management in Embedded Systems Using MEMS
Jeffrey T. Draper, Jay Block, Jeff Koller, Craig S...
GLVLSI
2005
IEEE
122views VLSI» more  GLVLSI 2005»
15 years 11 months ago
Thermal aware cell-based full-chip electromigration reliability analysis
A hierarchical scheme with cells and modules is crucial for managing design complexity during a large integrated circuit design. We present a methodology for thermal aware cell-ba...
Syed M. Alam, Donald E. Troxel, Carl V. Thompson
ICCAD
2009
IEEE
171views Hardware» more  ICCAD 2009»
15 years 3 months ago
A hybrid local-global approach for multi-core thermal management
Multi-core processors have become an integral part of mainstream high performance computer systems. In parallel, exponentially increasing power density and packaging costs have ne...
Ramkumar Jayaseelan, Tulika Mitra