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ISPD
2005
ACM
151views Hardware» more  ISPD 2005»
16 years 10 days ago
Thermal via placement in 3D ICs
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
Brent Goplen, Sachin S. Sapatnekar
DIGRA
2005
Springer
16 years 9 days ago
Shadowplay: Simulated Illumination in Game Worlds
Despite the fact that there are currently a number of enjoyable digital games in which light plays a key role, we lack a vocabulary with which to discuss simulated illumination in...
Simon Niedenthal
198
Voted
FOCS
2002
IEEE
15 years 11 months ago
Protocols and Impossibility Results for Gossip-Based Communication Mechanisms
In recent years, gossip-based algorithms have gained prominence as a methodology for designing robust and scalable communication schemes in large distributed systems. The premise ...
David Kempe, Jon M. Kleinberg
CASES
2007
ACM
15 years 10 months ago
INTACTE: an interconnect area, delay, and energy estimation tool for microarchitectural explorations
Prior work on modeling interconnects has focused on optimizing the wire and repeater design for trading off energy and delay, and is largely based on low level circuit parameters....
Rahul Nagpal, Arvind Madan, Bharadwaj Amrutur, Y. ...
SOUPS
2010
ACM
15 years 10 months ago
Parenting from the pocket: value tensions and technical directions for secure and private parent-teen mobile safety
An increasing number of high-tech devices, such as driver monitoring systems and Internet usage monitoring tools, are advertised as useful or even necessary for good parenting of ...
Alexei Czeskis, Ivayla Dermendjieva, Hussein Yapit...