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TCAD
2008
115views more  TCAD 2008»
15 years 6 months ago
Statistical Thermal Profile Considering Process Variations: Analysis and Applications
The nonuniform substrate thermal profile and process variations are two major concerns in the present-day ultradeep submicrometer designs. To correctly predict performance/ leakage...
Javid Jaffari, Mohab Anis
ISPASS
2009
IEEE
16 years 1 months ago
User- and process-driven dynamic voltage and frequency scaling
We describe and evaluate two new, independently-applicable power reduction techniques for power management on processors that support dynamic voltage and frequency scaling (DVFS):...
Bin Lin, Arindam Mallik, Peter A. Dinda, Gokhan Me...
DATE
2009
IEEE
215views Hardware» more  DATE 2009»
16 years 1 months ago
EMC-aware design on a microcontroller for automotive applications
In modern digital ICs, the increasing demand for performance and throughput requires operating frequencies of hundreds of megahertz, and in several cases exceeding the gigahertz r...
Patrice Joubert Doriol, Yamarita Villavicencio, Cr...
MICRO
2009
IEEE
113views Hardware» more  MICRO 2009»
16 years 1 months ago
The BubbleWrap many-core: popping cores for sequential acceleration
Many-core scaling now faces a power wall. The gap between the number of cores that fit on a die and the number that can operate simultaneously under the power budget is rapidly i...
Ulya R. Karpuzcu, Brian Greskamp, Josep Torrellas
SAC
2006
ACM
16 years 17 days ago
Mining and analyzing the topological structure of protein-protein interaction networks
We report a comprehensive evaluation of the topological structure of protein-protein interaction (PPI) networks by mining and analyzing graphs constructed from the publicly availa...
Daniel Duanqing Wu, Xiaohua Hu