Pre-bond testing of 3D stacked ICs involves testing individual dies before bonding. The overall yield of 3D ICs improves with prebond testability because designers can avoid stack...
Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung K...
Multi-tier systems that combine SSDs with SAS/FC and/or SATA disks mitigate the capital cost burden of SSDs, while benefiting from their superior I/O performance per unit cost an...
Jorge Guerra, Himabindu Pucha, Joseph S. Glider, W...
The accuracy of the object tracking is dependent on the tracking time interval. Smaller tracking time interval increases the accuracy of tracking a moving object. However, this inc...
Hadi Jamali Rad, Bahman Abolhassani, Mohammad Abdi...
Survivability is one of the critical issues and the most important research topics in the fields of wireless sensor networks (WSNs). Energy efficiency is one of the determining fac...
Process modeling and simulation was introduced to the Timberland Co. in order to help improve the company's increasingly complex and cross-functional business processes. Two ...