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177
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ICCD
2005
IEEE
16 years 3 months ago
2005
IEEE
3D integration is an emergent technology that has the potential to greatly increase device density while simultaneously providing faster on-chip communication. 3D fabrication invo...
155
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ICCD
2003
IEEE
16 years 3 months ago
2003
IEEE
Embedded processors like Intel’s XScale use dynamic branch prediction to improve performance. Due to the presence of context switches, the accuracy of these predictors is reduce...
175
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ICCD
2002
IEEE
16 years 3 months ago
2002
IEEE
With technology advancing toward deep submicron, leakage energy is of increasing concern, especially for large onchip array structures such as caches and branch predictors. Recent...
173
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ICCAD
2008
IEEE
16 years 3 months ago
2008
IEEE
— With process variation becoming a growing concern in deep submicron technologies, the ability to efficiently obtain an accurate estimate of failure probability of SRAM compone...
157
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ICCAD
2007
IEEE
16 years 3 months ago
2007
IEEE
— In order to reduce parasitic mismatch in analog circuits, some groups of devices are required to share a common centroid while being placed. Devices are split into smaller ones...