1732 search results - page 145 / 347 » The design of a reliable reputation system |
140
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DSD
2009
IEEE
16 years 1 months ago
2009
IEEE
— 3D stacked architectures provide significant benefits in performance, footprint and yield. However, vertical stacking increases the thermal resistances, and exacerbates tempe...
280
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SIGMOD
2007
ACM
16 years 6 months ago
2007
ACM
The popularity of high-density flash memory as data storage media has increased steadily for a wide spectrum of computing devices such as PDA's, MP3 players, mobile phones an...
156
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MICRO
2009
IEEE
16 years 1 months ago
2009
IEEE
With continued advances in CMOS technology, parameter variations are emerging as a major design challenge. Irregularities during the fabrication of a microprocessor and variations...
199
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MOBIWAC
2009
ACM
16 years 1 months ago
2009
ACM
Rapid evolution of wireless networking has provided wide-scale of different wireless access technologies like Bluetooth, ZigBee, 802.11a/b/g, DSRC, 3G UMTS, LTE, WiMAX, etc. The c...
177
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SAS
2007
Springer
16 years 18 days ago
2007
Springer
Abstract. Silicon chip design has passed a threshold whereby exponentially increasing transistor density (Moore’s Law) no longer translates into increased processing power for si...