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MR
2002
87views Robotics» more  MR 2002»
15 years 6 months ago
Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies
Gold to Gold Interconnection (GGI) flip chip bonding technology has been developed to bond the driver IC chip on the integrated circuit suspension used in hard disk drives (HDDs)....
C. F. Luk, Y. C. Chan, K. C. Hung
INFOCOM
2010
IEEE
15 years 5 months ago
Estimating Link Reliability in Wireless Networks: An Empirical Study and Interference Modeling
This is a supplementary document for explaining what we could not contain in the main paper. I. BASIC FUNCTIONS AND NOTATIONS In this section, we first define some useful functi...
Shinuk Woo, Hwangnam Kim
CPM
2010
Springer
140views Combinatorics» more  CPM 2010»
15 years 11 months ago
Bounds on the Minimum Mosaic of Population Sequences under Recombination
We study the minimum mosaic problem, an optimization problem originated in population genomics. We develop a new lower bound, called the C bound. The C bound is provably higher and...
Yufeng Wu
ISCA
2008
IEEE
188views Hardware» more  ISCA 2008»
16 years 29 days ago
MIRA: A Multi-layered On-Chip Interconnect Router Architecture
Recently, Network-on-Chip (NoC) architectures have gained popularity to address the interconnect delay problem for designing CMP / multi-core / SoC systems in deep sub-micron tech...
Dongkook Park, Soumya Eachempati, Reetuparna Das, ...
IJCGA
2008
132views more  IJCGA 2008»
15 years 6 months ago
Constructing the City Voronoi Diagram Faster
Given a set S of n point sites in the plane, the City Voronoi diagram partitions the plane into the Voronoi regions of the sites, with respect to the City metric. This metric is i...
Robert Görke, Chan-Su Shin, Alexander Wolff