4679 search results - page 736 / 936 » The Timely Computing Base Model and Architecture |
193
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DAC
2003
ACM
16 years 7 months ago
2003
ACM
Chemical-mechanical planarization (CMP) and other manufacturing steps in very deep-submicron VLSI have varying effects on device and interconnect features, depending on the local ...
163
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DAC
2004
ACM
16 years 7 months ago
2004
ACM
Electrothermal couplings between supply voltage, operating frequency, power dissipation and die temperature have been shown to significantly impact the energy-delay-product (EDP) ...
171
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DAC
2006
ACM
16 years 7 months ago
2006
ACM
Transistor leakage is poised to become the dominant source of power dissipation in digital systems, and reconfigurable devices are not immune to this problem. Modern FPGAs already...
196
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VLSID
2004
IEEE
16 years 6 months ago
2004
IEEE
We present a new design of an Embedded Speech Recognition System. It combines the aspects of both hardware and software design to implement a speaker dependent, isolated word, sma...
166
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ISPASS
2010
IEEE
16 years 1 months ago
2010
IEEE
—In the past ten years, computer architecture has seen a paradigm shift from emphasizing single thread performance to energy efficient, throughput oriented, chip multiprocessors...