State elements are increasingly vulnerable to soft errors due to their decreasing size, and the fact that latched errors cannot be completely eliminated by electrical or timing ma...
Continuously shrinking feature sizes result in an increasing susceptibility of circuits to transient faults, e.g. due to environmental radiation. Approaches to implement fault tol...
1 Soft errors induced by radiation are an increasing problem in the microelectronic field. Although traditional models estimate the reliability of memories suffering Single Event U...
We revisit a basic element of modern signal integrity analysis, the modeling of worst-case coupling capacitance effects within a switch factor (SF) based methodology. We show that...
Chemical-mechanical planarization (CMP) and other manufacturing steps in very deep-submicron VLSI have varying effects on device and interconnect features, depending on the local ...