1728 search results - page 230 / 346 » The Size of Power Automata |
144
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HPCA
2009
IEEE
16 years 7 months ago
2009
IEEE
Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and hi...
196
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ICC
2008
IEEE
16 years 29 days ago
2008
IEEE
— Rain, snow, gaseous, cloud, fog, scintillation and other atmospheric properties can have a distorting effect on signal fidelity of Ku and Ka bands, thus resulting in excessive ...
163
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MICRO
2008
IEEE
16 years 28 days ago
2008
IEEE
Shrinking transistor sizes and a trend toward low-power processors have caused increased leakage, high per-device variation and a larger number of hard and soft errors. Maintainin...
144
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PIMRC
2008
IEEE
16 years 27 days ago
2008
IEEE
Abstract—Multimedia applications for mobile devices are increasing and growing more sophisticated. Many of these applications require computationally intensive processing, such a...
194
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ISQED
2007
IEEE
16 years 24 days ago
2007
IEEE
The inductance effects become significant for sub-100nm process designs due to increasing interconnect lengths, lower interconnect resistance values and fast signal transition tim...