3806 search results - page 225 / 762 » The Power of Process |
163
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MICRO
2006
IEEE
16 years 16 days ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
177
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PPAM
2005
Springer
16 years 21 hour ago
2005
Springer
We present a web computing library (PUBWCL) in Java that allows to execute tightly coupled, massively parallel algorithms in the bulk-synchronous (BSP) style on PCs distributed ove...
160
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CASES
2004
ACM
15 years 12 months ago
2004
ACM
While the dynamic voltage scaling (DVS) techniques are efficient in reducing the dynamic energy consumption for the processor, varying voltage alone becomes less effective for t...
139
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ICCAD
2005
IEEE
16 years 3 months ago
2005
IEEE
The increasing variability of process parameters leads to substantial parametric yield losses due to timing and leakage power constraints. Leakage power is especially affected by ...
179
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GLOBECOM
2007
IEEE
16 years 26 days ago
2007
IEEE
—The growth of the Internet in the last years has been pushed by increasing requirements in terms of capacity, security and reliability. Moreover, improvements in multimedia appl...