A new high performance computation technique involving multiple processors on a single silicon die is quickly gaining popularity. This new design approach provides very high perfo...
Abstract— Interconnect has become a primary bottleneck in integrated circuit design. As CMOS technology is scaled, it will become increasingly difficult for conventional copper ...
- This paper compares two types of class E power amplifier and studies their applicability in EER (Envelope Elimination and Restoration) transmitter. In EER applications one of the...
— In this paper, we focus on the problem of designing an energy efficient MAC protocol for wireless sensor networks and propose a novel scheme, named as TEEM (Traffic aware, Ener...