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ISCA
2007
IEEE
113views Hardware» more  ISCA 2007»
16 years 1 months ago
Thermal modeling and management of DRAM memory systems
With increasing speed and power density, high-performance memories, including FB-DIMM (Fully Buffered DIMM) and DDR2 DRAM, now begin to require dynamic thermal management (DTM) a...
Jiang Lin, Hongzhong Zheng, Zhichun Zhu, Howard Da...
GLVLSI
2006
IEEE
119views VLSI» more  GLVLSI 2006»
16 years 26 days ago
Thermal analysis of a 3D die-stacked high-performance microprocessor
3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to conventional plan...
Kiran Puttaswamy, Gabriel H. Loh
MSWIM
2004
ACM
16 years 7 days ago
Detailed models for sensor network simulations and their impact on network performance
Recent trends in sensor network simulation can be divided between less flexible but accurate emulation based approach and more generic but less detailed network simulator models....
Maneesh Varshney, Rajive Bagrodia
ICPP
2002
IEEE
15 years 11 months ago
Software Caching using Dynamic Binary Rewriting for Embedded Devices
A software cache implements instruction and data caching entirely in software. Dynamic binary rewriting offers a means to specialize the software cache miss checks at cache miss t...
Chad Huneycutt, Joshua B. Fryman, Kenneth M. Macke...
219
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ICCD
2007
IEEE
195views Hardware» more  ICCD 2007»
15 years 10 months ago
LEMap: Controlling leakage in large chip-multiprocessor caches via profile-guided virtual address translation
The emerging trend of larger number of cores or processors on a single chip in the server, desktop, and mobile notebook platforms necessarily demands larger amount of on-chip last...
Jugash Chandarlapati, Mainak Chaudhuri